OM-TSOP-2

SMD Prototyping Adapter PCB for common Memory IC packages.  The part has three footprints, each incorporating a unique Patented pad pattern, which allows fitting of different body sizes and pin counts.

Two of the footprints are intended primarily for the connection of TSOP packages, (Type 1 and Type 2), but there is also a generic SOIC footprint which will accommodate SOJ type packages.

This breadboarding adapter has a maximum pin count of 56, which allows its use with most Flash Memory devices.

PCB Dimensions:- 1.5 x 1.85 inches

User connection:- 2 sets of 2 x 14way, 0.1 inch spaced holes (see image)

(* - This dimension is the distance between the sides which have the leads.  Note that for TSOP2 devices, the leads are normally on the shorter sides).

Dimensions in inches (mm)