SMD Prototyping Adapter PCB for common Memory IC packages. The part has three footprints, each incorporating a unique Patented pad pattern, which allows fitting of different body sizes and pin counts.
Two of the footprints are intended primarily for the connection of TSOP packages, (Type 1 and Type 2), but there is also a generic SOIC footprint which will accommodate SOJ type packages.
This breadboarding adapter has a maximum pin count of 56, which allows its use with most Flash Memory devices.
PCB Dimensions:- 1.5 x 1.85 inches
User connection:- 2 sets of 2 x 14way, 0.1 inch spaced holes (see image)
Footprint Name | Device Lead Pitch | Accommodates Device Body* Widths |
SOIC/SOJ | 0.05 (1.27) | 0.3 - 0.5 SOIC (7.6 - 13) SOIC 0.39 - 0.63 SOJ (10 - 16) SOJ |
TSOP1 | 0.0315 (0.8) | 0.3 - 0.53 (7.6 - 13.5) |
TSOP2 | 0.0197 (0.5) | 0.17 - 0.72 (4.4 - 18.4) |
(* - This dimension is the distance between the sides which have the leads. Note that for TSOP2 devices, the leads are normally on the shorter sides).
Dimensions in inches (mm)